Innovation of the latest architecture and packaging sectors at Intel, Hatchips 34 academic events
Intel is the latest architecture and 3D tile-based chip design that can continue Moore’s laws and enable 2.5D and 3D tile-based chip designs that can lead to the new era of semiconductor manufacturing in the Hot Chips 34 on the 24th. He said he will disclose innovation in the field of packaging.
Pat Gelsinger, CEO of Intel, gave a keynote speech as the second Intel CEO after the keynote speech by Gordon Moore in 1995. CEO Pat Pat is a keynote on this keynote, including Meteor Lake, Ponte Vecchio GPU, Intel® Xeon® D-2700 and 1700 and FPGA. It will unveil Intel’s roadmap that pursues more powerful computing, such as announcing and presenting a new system foundry model.
Pat Gelinger Intel said, Intel is based on various cutting-edge technologies such as ribbonfet, Powervia, high NaGH NA lithography and 2.5D and 3D packaging. It is developing with the goal of increasing the trillion by 2030. There was no better and more important era for technicians. We must all actively support today’s semiconductors to play an important role in life.
Currently, the semiconductor industry is welcoming the golden age that requires the transition to the accident method from the existing foundry model to the system foundry model. Intel’s system foundry model goes beyond traditional wafer manufacturing support, and provides a package (Systems-in-Package) that integrates advanced packaging, open viplet ecosystem and software components, requiring powerful computing functions and fully immersive digital experiences. Support to meet expectations. In addition, Intel intends to meet the industry’s demand through continuous development of process and tile-based design technology.
In the age of innovation, growth and discovery today, technology will fundamentally change the way we experience the world. Innovative technologies such as computing, connectivity, infrastructure, and AI, which are present everywhere, will be combined, amplified, and strengthened to present the future of technology and to help humanity achieve new levels of goals, continuing to create new possibilities..
Product architecture introduced by Intel at Hatchips 34
· Code name Ponte Vecchio Intel Data Center GPU is built to solve the computing density throughout the overall high-performance computing (HPC) and AI supercomputing workloads. It also uses OneAPI to make the most of Intel’s open software model, which simplifies programming between API abstraction and architecture. Ponte Beckio consists of several complex designs that appear as tiles connected using the combination of EMIB (embedded multi-dai interconnect bridge) and Fourthos advanced packaging technology. The high-speed MDFI interconnect allows you to expand the package up to two stacks, allowing more than 100 billion transistors to a single package.
· Xeon D-2700 and 1700 Series is designed to be used in edges of 5G, IoT, Enterprise and Cloud applications, and is designed to solve the difficulties of power and spatial constraints frequently occurring in the actual environmental environment.. It supports the latest computing core, 100g Ethernet with flexible packet processors, inline encryption acceleration, TCC (Time Coordinated Computing), TSN (Time-Sensitive Networking) and AI processing.
· FPGA Technology is a powerful and flexible tool for wireless frequency (RF) applications and hardware acceleration. Intel will integrate various process nodes and foundry contains, as well as digital and analog choppet, to shorten the development time and maximize the flexibility for developers, and share the results of the contemporary approach. 2022 Developer of the Year: Tahir Ghani (Tahir Ghani)